The POU3500 system provides dynamic temperature Charge of the method chamber cathode / electrode / anode and might be synchronized with any etch process.

thirty% of its peak electric power intake, giving our buyers significant reduction in running fees and increased trustworthiness.

the knowledge underneath is classified by semiconductor process and Resource manufacturer. Each and every table involves an purposes Matrix that shows qulified read more and business processes.

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LAUDA-Noah will, for a customer's retrofit analysis, watch and adjust its fluid temperature Regulate profiles to match an present TCUs' so as to guarantee a easy course of action integration via DAQ.

The accuracy from the POU 3300 permits independent control of the method fluid temperature on the wafer chuck within just +/- 0.one °C of set point, and also the quickly reaction time from the method allows for maximum wafer-to-wafer repeatability through the etch course of action.

All static TCUs involve extra cooling & heating capacities because of their really big process fluid reservoirs. The process fuid reservoir on LAUDA-Noah's dynamic temperature Handle procedure is under one gallon.

With the POU3300, you could reach unprecedented leads to etch efficiency, chamber uptime, minimized price of possession and fab Room utilization – all when enhancing your course of action trustworthiness.

The data pertains to a 300mm chamber temperature profile throughout a higher factor ratio Etch process, running at pretty higher RF energy situations (~three.8kW). The persuasive areas of this knowledge established are:

Dynamic Temperature Control, as implemented in systems like the LAUDA-Noah POU, is surely an technique that senses the temperature of the process fluid getting back from the procedure chamber’s wafer chuck (ESC) and dynamically adjusts the temperature of your supplied procedure fluid based on this authentic-time responses.

The TEs' can swap straight from heating to cooling, or visa-versa. they're able to activate & off while inside the heating or cooling mode and may improve or minimize the level of heating or cooling with no switching in any respect.

The POU3300 system delivers dynamic temperature control of the method chamber cathode / electrode / anode and will be synchronized with any etch process.

verified; TEs' characterize just one part of a chiller's layout. The switching & Command methods employed by a chiller will affect the TEs' trustworthiness.

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We have to have a lot less cooling/heating ability for the same software being a static TCU thanks to our tiny reservoir volume.